Reel to Reel Electroplating Process-Cu、Ni、Ag
Applicable Substrate Materials
C194、C5191、C2680
Common Material Thickness
Material Thickness 0.15〜0.60 mm
Material Width 30〜50 mm
Common Plating Thickness Range
Base Copper 0.00〜2.0µm
Base Nickel 0.00〜2.0µm
Silver Plating 0.00〜3.0µm