Reel to Reel Electroplating Process

 

Reel to Reel Electroplating Process-Cu、Ni、Ag

 

Applicable Substrate Materials

C194、C5191、C2680 

Common Material Thickness

Material Thickness 0.15〜0.60 mm

Material Width 30〜50 mm

Common Plating Thickness Range

Base Copper 0.00〜2.0µm 

Base Nickel   0.00〜2.0µm 

Silver Plating 0.00〜3.0µm